Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11114362
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Filing Dt:
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04/26/2005
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Publication #:
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Pub Dt:
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10/26/2006
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Inventors:
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Eiichi Hosomi, Yuichi Goto
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Title:
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METHOD AND SYSTEM FOR AN IMPROVED PACKAGE SUBSTRATE FOR USE WITH A SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9775 TOLEDO WAY |
| IRVINE, CALIFORNIA 92618-1811 |
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| SPRINKLE IP LAW GROUP |
| 1301 W. 25TH STREET |
| SUITE 408 |
| AUSTIN, TX 78705 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| SPRINKLE IP LAW GROUP |
| 1301 W. 25TH STREET, SUITE 408 |
| AUSTIN, TEXAS 78705 |
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