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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/02/2009
Application #:
11795423
Filing Dt:
07/17/2007
Publication #:
Pub Dt:
04/17/2008
PCT #:
US0604449
Inventors:
Geoffrey Bruce Gardner, Brian Robret Harkness
Title:
TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING
Assignment: 1
Reel/Frame:
017643/0698Recorded: 05/19/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/31/2006
Exec Dt:
02/06/2006
Assignee:
2200 WEST SALZBURG ROAD
PATENT DEPT. - MAIL CO1232
MIDLAND, MICHIGAN 48686-0994
Correspondent:
CHRISTINE M. FITAK
2200 WEST SALZBURG ROAD
PATENT DEPT. - CO1232
MIDLAND, MI 48686-0994

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