Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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11260391
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Inventor:
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Wai Mun Lee
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Title:
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COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2520 BARRINGTON COURT |
| HAYWARD, CALIFORNIA 94545-1163 |
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| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, D.C. 20004 |
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