Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2009
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Application #:
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10900458
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Filing Dt:
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07/28/2004
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Publication #:
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Pub Dt:
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02/10/2005
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Inventors:
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Minoru Takaya, Hisayuki Abe, Kei Suzuki, Kosuke Takano, Kenichi Kawabata, Toshikazu Endo
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Title:
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MODULE WITH EMBEDDED SEMICONDUCTOR IC AND METHOD OF FABRICATING THE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-13-1, NIHONBASHI, CHOU-KU |
| TOKYO 103-8272, JAPAN |
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| WOLFF & KING, PLLC |
| KEVIN ALAN WOLFF |
| 2111 EISENHOWER AVENUE |
| SUITE 402 |
| ALEXANDRIA, VA 22314 |
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