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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/07/2009
Application #:
11078907
Filing Dt:
03/11/2005
Publication #:
Pub Dt:
09/22/2005
Inventors:
WonHyoung Ryu, Seoung Jai Bai, Kyle Hammerick, Robert Lane Smith, Ralph S. Greco et al
Title:
3-D INTERCONNECTED MULTI-LAYER MICROSTRUCTURE OF THERMOPLASTIC MATERIALS
Assignment: 1
Reel/Frame:
016609/0456Recorded: 05/26/2005Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Exec Dt:
05/19/2005
Assignee:
1705 EL CAMINO REAL
OFFICE OF TECHNOLOGY LICENSING
PALO ALTO, CALIFORNIA 94306
Correspondent:
LUMEN INTELLECTUAL PROPERTY SERVICE, INC
ROBERT LODENKAMPER
2345 YALE STREET, 2ND FLOOR
PALO ALTO, CA 94306

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