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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/04/2009
Application #:
11044494
Filing Dt:
01/27/2005
Inventor:
Hyoung Jin Cho
Title:
INTERCONNECTING MICROFLUIDIC PACKAGE AND FABRICATION METHOD
Assignment: 1
Reel/Frame:
016233/0277Recorded: 01/27/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/20/2005
Assignee:
4000 CENTRAL FLORIDA BLVD.
ORLANDO, FLORIDA 32816
Correspondent:
BRIAN S. STEINBERGER, ESQ.
101 BREVARD AVE.
COCOA, FL 32922

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