Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
08/18/2009
|
Application #:
|
11564314
|
Filing Dt:
|
11/29/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/29/2008
| | | | |
|
Inventors:
|
Chih-Chao Yang, Haining Yang, Keith Kwong Hon Wong
|
|
Title:
|
DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE AND METHOD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| ROSA SUAZO |
| 2070 ROUTE 52 |
| 482 |
| HOPEWELL JUNCTION, NY 10504 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
|
|
|
|
| ELPIS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
|
|
Search Results as of:
05/08/2024 10:44 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
