Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11270676
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Filing Dt:
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11/08/2005
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Inventors:
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Wen-chou Vincent Wang, Yuan Li, Vadali Mahadev, Bruce Euzent
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Title:
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STRUCTURE AND ASSEMBLY PROCEDURE FOR LOW STRESS THIN DIE FLIP CHIP PACKAGES DESIGNED FOR LOW-K SI AND THIN CORE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| BEYER WEAVER & THOMAS, LLP |
| ATTN: ALTERA |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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