Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2009
|
Application #:
|
11948170
|
Filing Dt:
|
11/30/2007
|
|
Publication #:
|
|
Pub Dt:
|
06/04/2009
| | | | |
|
Inventors:
|
Yong Liu, Zhengyu Zhu, Zhongfa Yuan
|
|
Title:
|
SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS HAVING CLIP ATTACH STRUCTURES FOR ANGLED MOUNTING OF DICE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 82 RUNNING HILL ROAD |
| SOUTH PORTLAND, MAINE 04106 |
|
|
|
|
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
|
|
|
|
| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
|
|
Search Results as of:
04/29/2024 09:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
