Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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11752159
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Filing Dt:
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05/22/2007
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Publication #:
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Pub Dt:
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09/20/2007
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Inventors:
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DAI-GIL LEE, HUI-YUN HWANG, WOO-SEOK CHIN, SEUNG-MIN LEE, BYUNG-CHUL KIM, JAE-WOOK KWON et al
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Title:
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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 373-1 GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| KNOBBE MARTENS OLSON & BEAR LLP |
| 2040 MAIN STREET, 14TH FLOOR |
| IRVINE, CA 92614 |
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