Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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10623679
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Filing Dt:
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07/22/2003
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Publication #:
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Pub Dt:
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05/20/2004
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Inventors:
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Koji Nozaki, Miwa Kozawa
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Title:
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RESIST PATTERN THICKENING MATERIAL, RESIST PATTERN AND PROCESS FOR FORMING THE SAME, AND SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, KAMIKODANAKA 4-CHOME, NAKHARA-KU, KAWASAKI-SHI |
KANAGAWA 211-8588, JAPAN |
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ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO |
1725 K STREET, NW |
SUITE 1000 |
WASHINGTON, DC 20006 |
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Assignment:
2
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CORRECTED COVER SHEET TO CORRECT ASSIGNEE ADDRESS, PREVIOUSLY RECORDED AT REEL/FRAME 014307/0752 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
KAWASAKI-SHI, KANAGAWA 211, JAPAN 211-8588 |
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
1250 CONNECTICUT AVENUE, NW |
SUITE 700 |
WASHINGTON, DC 20036 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, KAMIKODANAKA 4-CHOME |
NAKAHARA-KU, KAWASAKI-SHI |
KANAGAWA 211-8588, JAPAN |
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
1250 CONNECTICUT AVENUE, NW |
SUITE 700 |
WASHINGTON, DC 20036 |
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