Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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11729650
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Filing Dt:
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03/29/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Inventors:
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Takeshi Wakabayashi, Ichiro Mihara, Osamu Okada
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Title:
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GROUNDING STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING A CONDUCTIVE
PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, HON-MACHI 1-CHOME, SHIBUYA-KU |
| TOKYO 151-8543, JAPAN |
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| FRISHAUF HOLTZ GOODMAN, ET AL. |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-6, IMAI 3-CHOME, OME-SHI, |
| TOKYO,, JAPAN 198-8555 |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001 |
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