Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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11409297
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Filing Dt:
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04/21/2006
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Publication #:
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Pub Dt:
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09/06/2007
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Inventors:
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Chin-Chiu Hsia, Chih-Hsiang Yao, Chih-Tang Peng, Tai-Chun Huang
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Title:
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BOND PAD STRUCTURE FOR WIRE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN ROC, 300-77 |
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STEVEN H. SLATER |
SLATER & MATSIL, L.L.P. |
17950 PRESTON RD. |
SUITE 1000 |
DALLAS, TEXAS 75252-5793 |
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