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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/22/2009
Application #:
11409297
Filing Dt:
04/21/2006
Publication #:
Pub Dt:
09/06/2007
Inventors:
Chin-Chiu Hsia, Chih-Hsiang Yao, Chih-Tang Peng, Tai-Chun Huang
Title:
BOND PAD STRUCTURE FOR WIRE BONDING
Assignment: 1
Reel/Frame:
017801/0058Recorded: 04/21/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/19/2006
Exec Dt:
04/19/2006
Exec Dt:
04/19/2006
Exec Dt:
04/19/2006
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN ROC, 300-77
Correspondent:
STEVEN H. SLATER
SLATER & MATSIL, L.L.P.
17950 PRESTON RD.
SUITE 1000
DALLAS, TEXAS 75252-5793

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