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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/29/2009
Application #:
11323809
Filing Dt:
12/30/2005
Publication #:
Pub Dt:
07/05/2007
Inventors:
Lucas David Barkley, Bruce David Gibson, Eric Spencer Hall, David G. King et al
Title:
METHODS AND APPARATUSES FOR SENSING TEMPERATURE OF MULTI-VIA HEATER CHIPS
Assignment: 1
Reel/Frame:
017386/0534Recorded: 03/28/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Exec Dt:
03/24/2006
Assignee:
740 WEST NEW CIRCLE ROAD
INTELLECTUAL PROPERTY LAW DEPT
LEXINGTON, KENTUCKY 40550
Correspondent:
SCOTT N. BARKER
LEXMARK INTERNATIONAL, INC
INTELLECTUAL PROPERTY LAW DEPT
740 WEST NEW CIRCLE ROAD
LEXINGTON, KY 40550
Assignment: 2
Reel/Frame:
030416/0001Recorded: 05/14/2013Pages: 51
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/01/2013
Exec Dt:
04/01/2013
Assignee:
7-7-1, NAKAGAITO, DAITO-SHI
OSAKA, JAPAN 5740013
Correspondent:
AMSTER, ROTHSTEIN & EBENSTEIN LLP
90 PARK AVENUE
NEW YORK, NY 10016
Assignment: 3
Reel/Frame:
051430/0989Recorded: 01/07/2020Pages: 4
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/24/2019
Assignee:
10015 OLD COLUMBIA ROAD
SUITE B-215
COLUMBIA, MARYLAND 21046
Correspondent:
MICHAEL A. SIEM
711 3RD AVENUE
SUITE 1900
NEW YORK, NY 10017

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