Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/29/2009
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Application #:
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11937208
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Filing Dt:
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11/08/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Inventors:
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Masayuki Nagamatsu, Ryosuke Usui
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Title:
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PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MOBILE APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-5, KEIHAN-HONDORI 2-CHOME, |
| MORIGUCHI-SHI, |
| OSAKA, JAPAN |
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| SAMUEL BORODACH |
| FISH & RICHARDSON P.C. |
| P.O.BOX 1022 |
| MINNEAPOLIS, MN 55440-1022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| BRANDON C. STALLMAN, ESQ. |
| CHRISTENSEN O'CONNOR JOHNSON KINDNESS |
| 1201 THIRD AVENUE, SUITE 3600 |
| SEATTLE, WA 98101 |
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