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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/06/2009
Application #:
11259959
Filing Dt:
10/24/2005
Publication #:
Pub Dt:
06/22/2006
Inventors:
Jin Woo Jeong, Dae Jun Kim, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
Title:
WAFER-SCALE MICROCOLUMN ARRAY USING LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE
Assignment: 1
Reel/Frame:
017153/0954Recorded: 10/24/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/21/2005
Exec Dt:
09/21/2005
Exec Dt:
09/20/2005
Exec Dt:
09/21/2005
Exec Dt:
09/16/2005
Assignees:
161 GAJEONG-DONG, YUSONG-GU
DAEJEON-CITY, KOREA, REPUBLIC OF
KALSAN-RI, TANGJEONG-MYEON, ASAN-CITY
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES, CA 90025

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