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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/13/2009
Application #:
10482056
Filing Dt:
10/08/2004
Publication #:
Pub Dt:
02/24/2005
Inventors:
Tsutomu Nishina, Kenji Okamoto
Title:
SOLDER COMPOSITION
Assignment: 1
Reel/Frame:
016300/0266Recorded: 06/02/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/22/2004
Exec Dt:
09/22/2004
Assignee:
1-11-2 OSAKI, SHINAGAWA-KU
TOKYO, JAPAN 141-0032
Correspondent:
STEVEN M. RABIN
RABIN & BERDO, P.C.
1101 14TH STREET
SUITE 500
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
026891/0655Recorded: 08/26/2011Pages: 18
Conveyance:
MERGER AND CHANGE OF NAME
Assignor:
Exec Dt:
04/01/2011
Assignee:
1-1, TANABESHINDEN, KAWASAKI-KU,
KAWASAKI-SHI, JAPAN
Correspondent:
ROSSI, KIMMS & MCDOWELL
20609 GORDON PARK SQUARE, SUTIE 150
ASHBURN, VA 20147

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