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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/20/2009
Application #:
10850597
Filing Dt:
05/19/2004
Publication #:
Pub Dt:
11/25/2004
Inventors:
Tsuyoshi Arai, Kiyomi Nagai, Naoyuki Ito, Kiyoshi Nagata
Title:
METHOD OF MOLDING HOLLOW COMPONENT WITH HIGH STRENGTH AND SEALABILITY AND THE HOLLOW COMPONENT
Assignment: 1
Reel/Frame:
015384/0311Recorded: 05/19/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2004
Exec Dt:
04/28/2004
Exec Dt:
04/28/2004
Exec Dt:
04/28/2004
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
H. KEITH MILLER, ESQ.
P.O. BOX 828
BLOOMFIELD HILLS, MICHIGAN 48303

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