Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11537058
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Filing Dt:
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09/29/2006
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Publication #:
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Pub Dt:
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04/03/2008
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Inventor:
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Kenji Suzuki
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Title:
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INTEGRATION OF A VARIABLE THICKNESS COPPER SEED LAYER IN COPPER METALLIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6 AKASAKA 5-CHOME, MINATO-KU |
| TBS BROADCAST CENTER |
| TOKYO, JAPAN 107 |
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| KRISTI L. DAVIDSON |
| 441 VINE STREET |
| 2700 CAREW TOWER |
| CINCINNATI, OH 45202 |
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