Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/10/2009
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Application #:
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12237052
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Filing Dt:
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09/24/2008
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Publication #:
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Pub Dt:
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04/02/2009
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Inventors:
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Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu et al
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Title:
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FLIP CHIP PACKAGE PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| J.C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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