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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7645364
Issue Dt:
01/12/2010
Application #:
10882712
Filing Dt:
06/30/2004
Publication #:
20080271992
Pub Dt:
11/06/2008
Inventors:
Yezdi N. Dordi, Fred C. Redeker, John M. Boyd, Robert Maraschin, Carl Woods
Title:
APPARATUS AND METHOD FOR PLATING SEMICONDUCTOR WAFERS
Assignment: 1
Reel/Frame:
015547/0709Recorded: 06/30/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
REDEKER, FRED C.
Exec Dt:
06/30/2004
BOYD, JOHN M.
Exec Dt:
06/30/2004
MARACHIN, ROBERT
Exec Dt:
06/30/2004
WOODS, CARL
Exec Dt:
06/30/2004
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
MARTINE PENILLA & GENCARELLA, LLP
ALBERT S. PENILLA
710 LAKEWAY DRIVE, SUITE 200
SUNNYVALE, CA 94085
Assignment: 2
Reel/Frame:
015938/0656Recorded: 10/29/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DORDI, YEZDI N.
Exec Dt:
10/25/2004
REDEKER, FRED C.
Exec Dt:
10/25/2004
BOYD, JOHN M.
Exec Dt:
10/25/2004
MARASCHIN, ROBERT
Exec Dt:
10/22/2004
WOODS, CARL
Exec Dt:
10/25/2004
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
MARTINE PENILLA & GENCARELLA, LLP
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085

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