Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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11822113
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Filing Dt:
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07/02/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Inventor:
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Cheng Tang Huang
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Title:
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PACKAGING CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR SUBSTRATE HAVING A METALLIC LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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