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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/23/2010
Application #:
11898950
Filing Dt:
09/18/2007
Publication #:
Pub Dt:
06/26/2008
Inventors:
Sheng-Hsiung Chen, Jen-Te Tseng
Title:
MULTI-CHIP PACKAGE
Assignment: 1
Reel/Frame:
019883/0823Recorded: 09/18/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/24/2007
Exec Dt:
07/24/2007
Assignee:
NO. 26, JINGSAN RD., NANTZ CHIU
KAOHSIUNG, TAIWAN 811 R.O.C.
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314

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