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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/23/2010
Application #:
11647384
Filing Dt:
12/29/2006
Publication #:
Pub Dt:
09/13/2007
Inventors:
Eun Jung Lee, Yoon Kok Park, Young Kyun Lee, Whan Gun Kim, Suk Ku Chang
Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
018754/0667Recorded: 12/29/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/28/2006
Exec Dt:
12/28/2006
Exec Dt:
12/28/2006
Exec Dt:
12/28/2006
Exec Dt:
12/28/2006
Assignee:
290, GONGDAN 2-DONG, GUMI-SI
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
EUGENE M. LEE
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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