Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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12019687
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Filing Dt:
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01/25/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Inventors:
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Young Woo Lee, Kyung In Kang, Byung Wook Jeong, Jae Pil Jung, Ki Ju Lee, Hee Yul Lee
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Title:
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LEAD FREE SOLDER CONTAINING SN, AG AND BI
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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316-2 GEUMEO-RI |
POGOK-MYEON |
YONGIN, KOREA, REPUBLIC OF |
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VOLPE AND KOENIG, P.C. |
UNITED PLAZA, SUITE 1600 |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103 |
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