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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7674651
Issue Dt:
03/09/2010
Application #:
11850767
Filing Dt:
09/06/2007
Publication #:
20080150135
Pub Dt:
06/26/2008
Inventors:
Yukifumi Oyama, Hidetoshi Nishiwaki, Yasumitsu Orii, Kazushige Toriyama et al
Title:
MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
Assignment: 1
Reel/Frame:
019789/0585Recorded: 09/06/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OYAMA, YUKIFUMI
Exec Dt:
09/03/2007
NISHIWAKI, HIDETOSHI
Exec Dt:
09/03/2007
NISHIO, TOSHIHIKO
Exec Dt:
09/03/2007
TORIYAMA, KAZUSHIGE
Exec Dt:
09/03/2007
ORII, YASUMITSU
Exec Dt:
09/03/2007
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
ANTHONY J. CANALE
1000 RIVER STREET
ESSEX JUNCTION, VT 05452
Assignment: 2
Reel/Frame:
031039/0015Recorded: 08/19/2013Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES
Exec Dt:
08/05/2013
Assignee:
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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