Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2010
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Application #:
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11868092
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Filing Dt:
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10/05/2007
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Publication #:
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Pub Dt:
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09/18/2008
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Inventors:
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Jeff BIAR, Chih-Kung HUANG
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Title:
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BASE SUBSTRATE FOR CHIP SCALE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 32, KUANG FU NORTH ROAD |
| HU KOU, HSIN-CHU, INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ... |
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| BROWDY AND NEIMARK, PLLC |
| 1625 K STREET, N.W. |
| SUITE 1100 |
| WASHINGTON, DC 20006 |
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