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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/13/2010
Application #:
12379523
Filing Dt:
02/24/2009
Publication #:
Pub Dt:
08/27/2009
Inventor:
Masaru Nakamura
Title:
WAFER DIVIDING METHOD
Assignment: 1
Reel/Frame:
022417/0980Recorded: 02/24/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/19/2009
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO 143-8580, JAPAN
Correspondent:
MICHAEL A. MAKUCH
SMITH, GAMBRELL & RUSSELL, LLP
1130 CONNECTICUT AVENUE, SUITE 1130
WASHINGTON, D.C. 20036
Assignment: 2
Reel/Frame:
022418/0346Recorded: 02/24/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/19/2009
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 143-8580
Correspondent:
MICHAEL A. MAKUCH
SMITH, GAMBRELL & RUSSELL, LLP
1130 CONNECTICUT AVENUE
SUITE 1130
WASHINGTON, DC 20036

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