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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/20/2010
Application #:
11295652
Filing Dt:
12/07/2005
Publication #:
Pub Dt:
06/22/2006
Inventors:
Ryuji Kanzaka, Hironori Tanikawa
Title:
RESIN MOLDED COMPONENT
Assignment: 1
Reel/Frame:
017330/0071Recorded: 12/07/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/17/2005
Exec Dt:
11/17/2005
Assignees:
1, TOYOTA-CHO, TOYOTA-SHI
AICHI-KEN 471-8571, JAPAN
1-1, KYOWA-CHO 1-CHOME, OBU-SHI
AICHI-KEN, 474-8588, JAPAN
Correspondent:
DAVID J. ZIBELLI
SUITE 700
1500 K STREET NW
WASHINGTON, DC 20005-1257

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