Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11283892
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Filing Dt:
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11/22/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Inventor:
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Hiroki Fukatsu
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Title:
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RESIN-MOLDED COMPONENT FOR SIGNAL READER AND METHOD FOR MOLDING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18-1, KONAN 2-CHOME |
| MINATO-KU |
| TOKYO 108-8280, JAPAN |
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| BUCHANAN INGERSOLL PC |
| (INCLUDING BURNS, DOANE, SWECKER & MATHI |
| POST OFFICE BOX 1404 |
| ALEXANDRIA, VA 22313-1404 |
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