Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11782356
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Filing Dt:
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07/24/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Inventors:
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Kan-Jung Chia, Shih-Ping Hsu
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Title:
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PACKAGE STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| LOWE HAUPTMAN HAM & BERNER LLP |
| 1700 DIAGONAL ROAD |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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