Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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10451610
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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03/23/2006
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Inventors:
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Tasao Soga, Hanae Hata, Toshiharu Ishida, Tetsuya Nakatsuka, Masahide Okamoto et al
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Title:
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SOLDER FOIL, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| ROBERT C. COLWELL |
| TWO EMBARCADERO CENER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| ROBERT C. COLWELL |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
3
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MERGER AND CHANGE OF NAME
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| ROGER HYLTON |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| KILPATRICK TOWNSEND & STOCKTON LLP |
| SAN FRANCISCO, CA 94111-3834 |
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