Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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10508426
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Filing Dt:
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09/16/2004
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Publication #:
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Pub Dt:
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06/02/2005
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Inventors:
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Masaki Egami, Eiichirou Shimazu
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Title:
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CONDUCTIVE RESIN MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-17, 1-CHOME, KYOMACHIBORI NISHI-KU |
| OSAKA, JAPAN 550-0003 |
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| JAMES V. COSTIGAN, ESQ. |
| HEDMAN & COSTIGAN, P.C. |
| 1185 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-2646 |
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