Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11365181
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Filing Dt:
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03/01/2006
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Publication #:
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Pub Dt:
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06/14/2007
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Inventor:
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Chih-Hsiung Lin
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Title:
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PACKAGE MODULE WITH ALIGNMENT STRUCTURE AND ELECTRONIC DEVICE WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, 535, CHUNG-CHENG RD. |
| HSIN-TIEN |
| TAIPEI, TAIWAN R.O.C. |
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| DANIEL R. MCCLURE |
| THOMAS, KAYDEN, HORSTEMEYER ET AL. |
| 100 GALLERIA PARKWAY |
| SUITE 1750 |
| ATLANTA, GA 30339 |
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