Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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11840615
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Filing Dt:
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08/17/2007
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Publication #:
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Pub Dt:
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02/19/2009
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Inventors:
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Masaharu Ninomiya, Koji Matsumoto, Masahiko Nakamae, Masanobu Miyao, Taizoh Sadoh
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER INCLUDING A STRAINED SILICON LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1 SHIBAURA 1-CHOME |
MINATO-KU |
TOKYO, JAPAN 105-8634 |
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10-1 HAKOZAKI 6-CHOME |
HIGASHI-KU, FUKUOKA-SHI |
FUKUOKA, JAPAN 812-8581 |
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JULES E. GOLDBERG |
599 LEXINGTON AVENUE, 29TH FLOOR |
REED SMITH, LLP |
NEW YORK, NY 10022 |
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