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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/10/2010
Application #:
12116152
Filing Dt:
05/06/2008
Publication #:
Pub Dt:
11/13/2008
Inventors:
Lu-Chen Hwan, Yu-Lin Ma, Po Ching Chen
Title:
PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE
Assignment: 1
Reel/Frame:
020922/0657Recorded: 05/08/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/2008
Exec Dt:
04/30/2008
Exec Dt:
04/30/2008
Assignee:
2F., NO. 21, LANE 195, HUACHENG ROAD
XINZHUANG CITY, TAIWAN 242
Correspondent:
SNELL & WILMER L.L.P.
ONE ARIZONA CENTER, 400 E VAN BUREN
CYNTHIA L. PILLOTE
PHOENIX, AZ 85004-2202
Assignment: 2
Reel/Frame:
025738/0088Recorded: 02/03/2011Pages: 16
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/18/2010
Assignee:
NO. 160, KESYUE RD., CHU-NAN SITE
HSINCHU SCIENCE PARK, CHU-NAN
MIAO-LI COUNTY, TAIWAN 350
Correspondent:
DANIEL R. MCCLURE
600 GALLERIA PARKWAY
SUITE 1500
ATLANTA, GA 30339

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