Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/2010
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Application #:
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11262897
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Filing Dt:
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11/01/2005
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Publication #:
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Pub Dt:
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05/04/2006
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Inventors:
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Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Seiichi Suda, Satoshi Kitaoka et al
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Title:
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LOW-ADHESION MATERIAL, MOLD FOR MOLDING RESIN USING THE SAME AND CONTAMINANT ADHESION PREVENTING MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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| 4-1, MUTSUNO 2-CHOME, ATSUTA-KU |
| NAGOYA-SHI, AICHI, JAPAN 456-8587 |
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| CHARLES GORENSTEIN |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSR ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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