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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/07/2010
Application #:
12067113
Filing Dt:
07/10/2008
Publication #:
Pub Dt:
02/19/2009
Inventors:
Wae Chet Yong, Mohd Fauzi HJ Mahat, Stanley Job Doraisamy, Tien Lai Tan
Title:
SEMICONDUCTOR COMPONENT HAVING MAXIMIZED BONDING AREAS OF ELECTRICALLY CONDUCTIVE MEMBERS CONNECTED TO SEMICONDUCTOR DEVICE AND CONNECTED TO LEADFRAME AND METHOD OF PRODUCING
Assignment: 1
Reel/Frame:
021220/0100Recorded: 07/10/2008Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2008
Exec Dt:
03/24/2008
Exec Dt:
03/24/2008
Exec Dt:
03/21/2008
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MARK L. GLEASON
FIFTH ST. TOWERS, 100 SOUTH FIFTH ST.
SUITE 2250
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
022069/0623Recorded: 01/07/2009Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2008
Exec Dt:
03/24/2008
Exec Dt:
03/24/2008
Exec Dt:
03/21/2008
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MARK L. GLEASON
FIFTH ST. TOWERS, 100 SOUTH FIFTH ST.
SUITE 2250
MINNEAPOLIS, MN 55402

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