Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/14/2010
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Application #:
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11340407
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Filing Dt:
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01/26/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Inventors:
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Akira Shimizu, Hidenobu Matsuyama
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Title:
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ULTRASONIC BONDING EQUIPMENT AND RESULTING BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 TAKARA-CHO, KANAGAWA-KU |
| YOKOHAMA-SHI, KANAGAWA 221-0023, JAPAN |
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| KENT J. SIEFFERT |
| SHUMAKER & SIEFFERT, P.A. |
| 8425 SEASONS PARKWAY, SUITE 105 |
| ST. PAUL, MN 55125 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1 HIRONODAI 2-CHOME |
| ZAMA-SHI, KANAGAWA, JAPAN 252-0012 |
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| FOLEY AND LARDNER LLP SUITE 500 |
| 3000 K STREET NW |
| WASHINGTON, DC 20007 |
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