Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/14/2010
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Application #:
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11539133
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Filing Dt:
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10/05/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Inventors:
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Tae-Hun Kim, Hak-Kyoon Byun, Sung-Yong Park, Heung-Kyu Kwon
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Title:
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WIRING SUBSTRATE HAVING VARIOUSLY SIZED BALL PADS, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND STACK PACKAGE USING THE SEMICONDUCTOR PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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HOSOON LEE |
210 SW MORRISON STREET, SUITE 400 |
PORTLAND, OR 97204 |
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