skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 2
Patent #:
Issue Dt:
09/21/2010
Application #:
11661821
Filing Dt:
06/01/2007
Publication #:
Pub Dt:
11/08/2007
Inventors:
Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani
Title:
PROCESS FOR FORMING BUMPS AND SOLDER BUMP
Assignment: 1
Reel/Frame:
019548/0722Recorded: 07/12/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/13/2007
Exec Dt:
04/04/2007
Exec Dt:
04/10/2007
Exec Dt:
03/30/2007
Exec Dt:
03/30/2007
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
KENJI KAMATA
1130 CONNECTICUT AVE., N.W., SUITE 1100
PANASONIC PATENT CENTER
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
021897/0606Recorded: 11/21/2008Pages: 18
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2008
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
KENJI KAMATA
1130 CONNECTICUT AVE., N.W., SUITE 1100
PANASONIC PATENT CENTER
WASHINGTON, DC 20036

Search Results as of: 03/29/2024 02:14 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT