Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/21/2010
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Application #:
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12226764
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Filing Dt:
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05/11/2009
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Publication #:
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Pub Dt:
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09/24/2009
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Inventors:
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Naohiko Hirano, Yoshitsugu Sakamoto, Minoru Ueshima, Takashi Ishii, Tomomi Okumura et al
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Title:
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SOLDER PREFORM AND ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-SHI, AICHI, JAPAN 448-8661 |
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| POSZ LAW GROUP, PLC |
| 12040 SOUTH LAKES DRIVE |
| SUITE 101 |
| RESTON, VA 20191 |
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