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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/19/2010
Application #:
11325166
Filing Dt:
01/04/2006
Publication #:
Pub Dt:
07/13/2006
Inventors:
Hiromi Fujisawa, Masaru Ishibashi, Rei Imai
Title:
WIRE LOOP, SEMICONDUCTOR DEVICE HAVING SAME AND WIRE BONDING METHOD
Assignment: 1
Reel/Frame:
017444/0559Recorded: 01/04/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2005
Exec Dt:
12/26/2005
Exec Dt:
12/26/2005
Assignee:
1-5, SAKAECHO, 3-CHOME, HAMURA-SHI
TOKYO, JAPAN
Correspondent:
JOSEPH W. PRICE
SNELL & WILMER LLP
600 ANTON BOUEVARD, SUITE 1400
COST MESA, CA 92626

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