Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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12273238
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Filing Dt:
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11/18/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Inventor:
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Tsing Chow Wang
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Title:
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METHOD OF FORMING LOW STRESS MULTI-LAYER METALLURGICAL STRUCTURES AND HIGH RELIABLE LEAD FREE SOLDER TERMINATION ELECTRODES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANG JIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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