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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/09/2010
Application #:
11807084
Filing Dt:
05/24/2007
Publication #:
Pub Dt:
10/04/2007
Inventors:
Hideo Kobayashi, Shinichi Shinohara, Hironobu Nishimura, Yukio Utsunomiya
Title:
METHOD AND APPARATUS FOR CURING ADHESIVE BETWEEN SUBSTRATES, AND DISC SUBSTRATE BONDING APPARATUS
Assignment: 1
Reel/Frame:
019411/0743Recorded: 05/24/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Assignee:
18-1 TAKADA 1-CHOME, TOSHIMA-KU
TOKYO, JAPAN
Correspondent:
ANTON E. SKAUGSET
KOLISCH HARTWELL, P.C.
520 S.W. YAMHILL STREET, SUITE 200
PORTLAND, OREGON 97204

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