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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/23/2010
Application #:
11220759
Filing Dt:
09/07/2005
Publication #:
Pub Dt:
04/12/2007
Inventors:
Ming Sun, Yueh Se Ho
Title:
Packages for electronic devices implemented with laminated board with a top and a bottom patterned metal layers
Assignment: 1
Reel/Frame:
016966/0023Recorded: 09/07/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/17/2005
Exec Dt:
08/17/2005
Assignee:
495 MERCURY DRIVE
SUNNYVALE, CALIFORNIA 94085
Correspondent:
BO-IN LIN
13445 MANDOLI DRIVE
LOS ALTOS HILLS, CA 94022
Assignment: 2
Reel/Frame:
021181/0357Recorded: 07/01/2008Pages: 2
Conveyance:
CHANGE ASSIGNEE'S ADDRESS
Assignors:
Exec Dt:
08/17/2005
Exec Dt:
08/17/2005
Assignee:
CANNON'S COURT, 22 VICTORIA STREET
HAMILTON HM12, BERMUDA
Correspondent:
BO-IN LIN
13445 MANDOLI DRIVE
LOS ALTOS HILLS, CA 94022

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