Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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10598515
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Filing Dt:
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09/01/2006
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Publication #:
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Pub Dt:
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09/25/2008
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Inventors:
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Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa
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Title:
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SEALANT EPOXY-RESIN MOLDING MATERIAL, AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHISHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN 163-0449 |
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| GRIFFIN & SZIPL, P.C. |
| 2300 9TH STREET SOUTH |
| SUITE PH-1 |
| ARLINGTON, VA 22204 |
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