Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12357836
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Filing Dt:
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01/22/2009
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Publication #:
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Pub Dt:
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07/22/2010
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Inventors:
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WILLIAM LOUIS BRODSKY, AMANDA ELISA ENNIS MIKHAIL
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Title:
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METHOD OF COMPENSATING FOR THERMAL EXPANSION IN SMT INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| THE LAW FIRM OF ANDREA HENCE EVANS, LLC |
| 14625 BALTIMORE AVE., #853 |
| LAUREL, MD 20707 |
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