Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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11384277
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Filing Dt:
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03/21/2006
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Publication #:
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Pub Dt:
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10/12/2006
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Inventors:
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Satoshi Nakamura, Takashi Suga, Mitsuaki Katagiri, Yukitoshi Hirose
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Title:
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MULTICHIP PACKAGE OR SYSTEM-IN PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| 2-1, YAESU 2-CHOME |
| CHUO-KU, TOKYO 104-0028, JAPAN |
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| JOHN R. MATTINGLY |
| MATTINGLY, STANGER, MALUR & BRUNDIDGE PC |
| 1800 DIAGONAL ROAD, SUITE 370 |
| ALEXANDRIA, VIRGINIA 22314 |
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Assignment:
2
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| 250 2-1, YAESU 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0028 |
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| THOMAS H. JENKINS |
| FINNEGAN, HENDERSON, FARABOW, GARRETT |
| & DUNNER, L.L.P. |
| 901 NEW YORK AVENUE, N.W. |
| WASHINGTON, D.C. 20001-4413 |
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