Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12302113
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Filing Dt:
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11/24/2008
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Publication #:
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Pub Dt:
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06/04/2009
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Inventors:
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Masachika Masuda, Chikao Ikenaga, Koji Tomita
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Title:
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RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BASE MATERIAL FOR THE SEMICONDUCTOR DEVICE, AND LAYERED AND RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, ICHIGAYA-KAGA-CHO 1-CHOME |
| SHINJUKU-KU, TOKYO-TO, JAPAN |
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| BURR & BROWN |
| PO BOX 7068 |
| SYRACUSE, NY 13261-7068 |
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